SD-900M Ion Sputterer Introduction SD-900M ion sputtering instrument has a beautiful appearance and exquisite workmanship. Magnetron sputtering is a kind of physical vapor deposition (PVD). The general sputtering method can be used to prepare metals, semiconductors, insulators and other materials, and has the advantages of simple equipment, easy control, large coating area and strong adhesion. The magnetron sputtering method realizes high speed, low temperature and low damage. Because high-speed sputtering is carried out at low pressure, the ionization rate of gas must be effectively improved. Magnetron sputtering increases the sputtering rate by introducing a magnetic field on the surface of the target cathode and using the magnetic field to constrain the charged particles to increase the plasma density. Equipped with high qualitative leap vacuum pump Applicable products: 1. Electron beam sensitive samples It mainly includes biological samples, plastic samples, etc. The electron beam in SEM has high energy. During the interaction with the sample, it transfers part of the energy to the sample in the form of heat. If the sample is sensitive to electron beam, this interaction will destroy part or even the whole sample structure. In this case, the surface coating prepared with a non electron beam sensitive material can act as a protective layer to prevent such damage; 2. Nonconductive sample Because the sample is non-conductive, its surface has an "electron trap", and the accumulation of electrons on this surface is called "charging". In order to eliminate the charging effect, the sample surface can be coated with a metal conductive layer, which acts as a conductive channel to transfer charged electrons away from the material surface to eliminate the charging effect. Sputtered materials increase the signal-to-noise ratio during the formation of scanning electron microscopy, thus obtaining better imaging quality. 3. New materials Observation of conductive characteristics of experimental electrode made of non-conductive materials Technical parameters: Sputtering gas: argon, nitrogen and other gases can be added according to the experimental purpose. Sputtering target: the standard target is a gold target with a thickness of 50mm * 0.1mm. Silver target and platinum target can also be equipped according to the actual situation. Sputtering current: maximum current 50mA, maximum working current 30mA Sputtering rate: better than 60nm/min Size of sample bin: 160mm in diameter and 120mm in height Size of sample table: the sample table can be installed with a diameter of 50mm and 70mm, or customized according to your own requirements Working voltage: 220V (110V), 50HZ
Introduction SD-900M ion sputtering instrument has a beautiful appearance and exquisite workmanship. Magnetron sputtering is a kind of physical vapor deposition (PVD). The general sputtering method can be used to prepare metals, semiconductors, insulators and other materials, and has the advantages of simple equipment, easy control, large coating area and strong adhesion. The magnetron sputtering method realizes high speed, low temperature and low damage. Because high-speed sputtering is carried out at low pressure, the ionization rate of gas must be effectively improved. Magnetron sputtering increases the sputtering rate by introducing a magnetic field on the surface of the target cathode and using the magnetic field to constrain the charged particles to increase the plasma density. Equipped with high qualitative leap vacuum pump
