Introduction: The plasma plasma cleaner system consists of three major components: 1. Host connection power supply to connect cooling process gas, high RF voltage plasma source control module, gas control module, front panel operation control system, and flexible conduit for gas and energy transfer. Plasma Jet: consists of the middle electrode, the outer electrode and the insulation area. The high-voltage RF generator converts the constant voltage to a high voltage (more than 10 kV), which is necessary for forming a high-voltage discharge. The high voltage and cooled process gas is delivered to the discharge area through a flexible conduit. The active elements in the gas stream (i+, e-, r*) create arcs in the discharge area. The active gas flow is focused on the surface of the sample when passing through a special nozzle head to achieve the treatment effect. Plasma Plasma Cleaner Applications: Metals - Removal of metal surface oils, oils and other organic substances and oxide layers; Automotive manufacturing - Plastics and paint pretreatments used in automotive manufacturing processes; Textile production - Used in Hydrophilic, hydrophobic and surface modification treatments for textiles, filters and membranes; biomedical --- Petri dishes increase activity, vascular stents, syringes, catheters and various materials for pro-runners, cross-coating before treatment. Aerospace - pretreatment of surface coating of insulating materials, electronic components, etc.; cleaning and etching of electronic - circuit boards. Films, PP and other materials without oxidation and activation treatment to improve solderability; semiconductor industry --- wafer processing and processing to remove photoresist, pre-package pre-treatment; LED --- bracket pre-cleaning before packaging; plastic rubber - - Improve the surface activity of materials such as PS, PE, PTFE, TPE, POM, AS, and PP to make them easier to bond and print. Technical Parameters: Model: PL-BM6 Supply voltage: 220(±10%)VAC,50/60Hz Power input fuse: 10A/250V Processing area: 3-6mm Operating frequency: 18KHz～60KHz Working pressure: 2KV ~ 7KV Maximum practical output power: 0-1000W (continuously adjustable) More extensive testing Maximum power consumption: ≤1100W Working pressure range: 0.05MPa～0.4MPa (0.5Kg～4Kg) Gas source requirements: 0.1MPa ~ 1.0Mpa (3Kg ~ 10Kg), no oil anhydrous Host volume: length, width and height 437*140*350mm Output cable length: net length ≥ 3000mm, customizable Head volume: MAX 236 × 45 × 45mm
Introduction: The plasma plasma cleaner system consists of three major components: 1. Host connection power supply to connect cooling process gas, high RF voltage plasma source control module, gas control module, front panel operation control system, and flexible conduit for gas and energy transfer. Plasma Jet: consists of the middle electrode, the outer electrode and the insulation area. The high-voltage RF generator converts the constant voltage to a high voltage (more than 10 kV), which is necessary for forming a high-voltage discharge. The high voltage and cooled process gas is delivered to the discharge area through a flexible conduit. The active elements in the gas stream (i+, e-, r*) create arcs in the discharge area. The active gas flow is focused on the surface of the sample when passing through a special nozzle head to achieve the treatment effect. Plasma Plasma Cleaner Applications: Metals - Removal of metal surface oils, oils and other organic substances and oxide layers; Automotive manufacturing - Plastics and paint pretreatments used in automotive manufacturing processes; Textile production - Used in Hydrophilic, hydrophobic and surface modification treatments for textiles, filters and membranes; biomedical --- Petri dishes increase activity, vascular stents, syringes, catheters and various materials for pro-runners, cross-coating before treatment. Aerospace - pretreatment of surface coating of insulating materials, electronic components, etc.; cleaning and etching of electronic - circuit boards. Films, PP and other materials without oxidation and activation treatment to improve solderability; semiconductor industry --- wafer processing and processing to remove photoresist, pre-package pre-treatment; LED --- bracket pre-cleaning before packaging; plastic rubber - - Improve the surface activity of materials such as PS, PE, PTFE, TPE, POM, AS, and PP to make them easier to bond and print.
