Introduction: This product has the characteristics of high precision, quick response, good handling and compatibility, perfect function and professional technical support. Applicable to camera and industry, mobile phone manufacturing, semiconductor IC field, silicone, plastic, polymer field, automotive electronics industry, aviation industry. Specifically applies to: 1, camera, fingerprint identification industry: soft and hard gold plated PAD surface oxidation; IR surface cleaning, cleaning. 2. Field of semiconductor ICs: COB, COG, COF, and ACF processes for wire cleaning and cleaning before soldering. 3, Silicone, plastic, and polymer fields: Surface roughening, etching, and activation of silicone, plastic, and polymers. Technical Parameters: Machine name: vacuum plasma cleaner Machine Model: OKSUN-PM120L/PM180L The whole specification: PM120L: 1320(W)×1720(H)×1030(D)mm PM180L: 1400(W)×1720(H)×1050(D)mm Electrode specification: PM120L: 10-layer flat plate (470(W)×410(D)mm) can be customized PM180L: 10-layer flat plate (530(L)×400(W)mm) can be customized Power System: 5KW Plasma Generation Source (40KHz, optional 13.56MHz) Control System: Touch Screen + PLC Automatic Control Intake system: 2-3 working gas options: Ar2, N2, H2, CF4, O2
Introduction: This product has the characteristics of high precision, quick response, good handling and compatibility, perfect function and professional technical support. Applicable to camera and industry, mobile phone manufacturing, semiconductor IC field, silicone, plastic, polymer field, automotive electronics industry, aviation industry. Specifically applies to: 1, camera, fingerprint identification industry: soft and hard gold plated PAD surface oxidation; IR surface cleaning, cleaning. 2. Field of semiconductor ICs: COB, COG, COF, and ACF processes for wire cleaning and cleaning before soldering. 3, Silicone, plastic, and polymer fields: Surface roughening, etching, and activation of silicone, plastic, and polymers.
