JG32 picosecond laser cutting machine Introduction:
The picosecond laser cutting machine is suitable for the cutting and forming of cover film (CVL), flexible board (FPC), hard and soft bonded board (RF) and thin multilayer board, as well as window opening and uncovering; it can also be used for cutting various substrates. , such as ceramics, silicon wafers, aluminum foil, Teflon, glass, etc. Features:
1. Slight carbonization: Carbonization is extremely weak compared to nanosecond laser processing.
2. Faster: Several times faster than nanosecond machining
3. Cutting effect: The processing surface is finer, smoother, neat and clean;
4. More extensive processing materials: In addition to the traditional circuit board polymer materials and copper foil processing, picoseconds can also be processed, ceramics, silicon, Teflon and other materials;
5. High intelligence: Support EMCS, MES system, automatic cutting and cutting graphics unit using identification QR code. Technical Parameters:
Applications: FPC, CVL, FPC micro connections, ceramics, wafers, etc.
Comprehensive machining accuracy : ±20μm
Laser power: 15W@400kHz
Laser wavelength: 355nm
Frequency range: 4Hz-1 MHz
1. Processing format: 550mmx650mm
2. Number of counters: Single beam, dual platform
Size: 2200mmx2150mmx1750mm (not including 3 color lights)
Weight: 3700Kg
Introduction:
The picosecond laser cutting machine is suitable for the cutting and forming of cover film (CVL), flexible board (FPC), hard and soft bonded board (RF) and thin multilayer board, as well as window opening and uncovering; it can also be used for cutting various substrates. , such as ceramics, silicon wafers, aluminum foil, Teflon, glass, etc.
