JG18 UV laser cutting machine Introduction:
Suitable for cutting and forming of cover film (CVL), flexible board (FPC), hard and soft bonded board (RF) and thin multilayer board, as well as windowing and uncovering; expandable for cutting various substrates such as ceramics, Wafers and so on. Features:
1, high precision;
2, high cutting quality;
3, high efficiency;
4, high intelligence. Technical Parameters:
Model: JG18
Laser wavelength: 355nm
Laser maximum average power: 10W
Laser repetition frequency: 30-120kHz
Maximum processing width: 720mmx540mm
Platform maximum operating speed: 800mm/s
Platform positioning accuracy: ±3μm
Platform repeatability: ±1μm
Comprehensive machining accuracy: ±20μm
Focusing spot: 20±5μm
Galvanometer scanning range: 45mmx45mm
File Format: *.gbr & *.dxf & *.lay
Power supply and power: AC220V/2kW; AC380V/5.5kW
Dimensions: 1780mmx1610mmx1650mm
Weight: 2300kg
Ambient temperature: 20°C±2°C
Ambient humidity: ≤60%RH, non-condensing Non-condensing
Foundation amplitude: ≤5μm
Ground pressure: 1000kgf/m
Introduction:
Suitable for cutting and forming of cover film (CVL), flexible board (FPC), hard and soft bonded board (RF) and thin multilayer board, as well as windowing and uncovering; expandable for cutting various substrates such as ceramics, Wafers and so on.
