JG16C UV laser cutting machine Introduction
Suitable for cutting and forming of cover film (CVL), flexible board (FPC), soft and hard bonding board (RF) and thin multi-layer board, as well as window opening and uncovering. Features
1. Double countertops, zero loading and unloading time, improve processing efficiency;
2. Preview function before processing to avoid scrapping the cutting board;
3. Two-dimensional code marking. Technical parameter
Project: JG16C
Laser wavelength: 355nm
Laser maximum average power: 10W standard, optional 15W
Laser repetition frequency: 30-120kHz
Maximum processing width: 650mmx550mm (dual platform)
Maximum operating speed of the platform: 800mm/s
Platform positioning accuracy: ±3μm
Repeated positioning accuracy of the platform: ±1μm
Comprehensive processing accuracy: ±20μm
Focus spot: 20±5μm
Galvanometer scanning range: 45mmx45mm
File format: *.gbr & *.dxf & *.lay
Power and power: AC380V/5.5kW
Dimensions: 1780mmx1610mmx1650mm
Weight: 3600kg
Ambient temperature: 20 °C ± 2 °C
Ambient humidity: ≤60% RH, no condensation, non-condensing
Ground amplitude: ≤5μm
Ground pressure: 1000kgf/m
Suitable for cutting and forming of cover film (CVL), flexible board (FPC), soft and hard bonding board (RF) and thin multi-layer board, as well as window opening and uncovering.
