JG16 UV laser cutting machine Introduction
Suitable for cutting and forming of cover film (CVL), flexible board (FPC), soft and hard bonding board (RF) and thin multi-layer board, as well as window opening and uncovering. Features
1. Double countertops, zero loading and unloading time, improve processing efficiency
2. Preview function before processing to avoid scrapping the cutting board;
3. Two-dimensional code marking. Technical parameters
Model: JG16
Laser wavelength: 355nm
Laser maximum average power: 10W standard, optional 15W
Laser repetition frequency: 30-120kHz
Maximum processing width: 500mmx400mm (dual platform)
Maximum operating speed of the platform: 800mm/s
Platform positioning accuracy: ±3μm
Repeated positioning accuracy of the platform: ±1μm
Comprehensive processing accuracy: ±20μm
Focus spot: 20±5μm
Galvanometer scanning range: 45mmx45mm
File format: *.gbr & *.dxf & *.lay
Power and power: AC220V/2kW; AC380V/5.5kW
Dimensions: 1850mmx1640mmx1650mm
Weight: 2400kg
Ambient temperature: 20 °C ± 2 °C
Ambient humidity: ≤60% RH, no condensation, non-condensing
Ground amplitude: ≤5μm
Ground pressure: 1000kgf/m
Suitable for cutting and forming of cover film (CVL), flexible board (FPC), soft and hard bonding board (RF) and thin multi-layer board, as well as window opening and uncovering.
