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DT150 automatic drop testing machine for Package strength testing

Product ID:WSHdl002

Price: Please inquire PDF Format
Supply Ability:20SETS/MON
Port:SHENZHEN
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  • Product Introduction
  • Consulting
  • Model NumberDT150
    Brand NameYM
    Payment TermsT/T, paypal
    Brief introduction
    The Single arm heavy load package drop testing machine simulates a environment of package drop to test falling damage of product package and evaluate the impact resistance strength during transportation. It is applied to electronic parts, ready made products and package, etc.
    features
    1. The spindle is used by precision grinding shaft lever, high precision, good stability
    2. LCD screen displays multi-parameter.
    3. Power failure safety design, keeping the original state when the power is failed.
    4. Up and down lifting limitation setting
    5. Adopt single arm supports test object.
    6. Swing arm system is controlled by air pressure.
    7. Free adjust pressure and speed up to 2G with object weight.
    8. Test elctronic parts, finished products or angle surfae of the package container.
    9. Decompression change design, low noise.
    10. Best after sales service: One year free parts maintenance.
    11. Meet international test standards.
    12. Customization is available & welcomed.
    Technical indicators
    Model YDT-150A YDT-200A YDT-150B YDT-200B
    Type Single arm supporting the specimen
    Test height(mm) 30-150 30 - 200 300 -150 300 - 200
    Max. specimen size(mm) 1000*1000*800
    Max. specimen weight 85 KG
    Overall weight 480Kg 550Kg 480Kg 550Kg
    Overall size(mm) 1500*1000*2250
    Baseplate size 1500*1000*20
    Control method By electronic controller box
    Dropping method Pneumatic cylinder
    Height display LCD display reads drop height
    Height adjustment Servo motor controlling precision guiding
    Buffer type Oil pressure absorbability
    Power AC220V 50Hz 1 Phase

  • Brief introduction
    The Single arm heavy load package drop testing machine simulates a environment of package drop to test falling damage of product package and evaluate the impact resistance strength during transportation. It is applied to electronic parts, ready made products and package, etc.


     
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