XG5010 semi-automatic X-ray inspection machine Introduction
The X-ray inspection machine adopts the principle of X-ray transmission to perform real-time photo detection on the internal structure of the object under test. Widely used in battery, SMT, LED, electronic product processing and casting processing industries, mainly to analyze the internal defects of the product, so that users can easily obtain high-quality, high-magnification, high-resolution images. Features
Measurement function: linear distance, circle diameter, concentric circle, point and center distance measurement, etc., 2.5D detection
CNC function: Memory programming, automatic recording and detection of motion path, accurate positioning, convenient for small batches of repeated detection.
Navigation and positioning function: Large navigation window, mouse clicks on any area of the image to be measured, and automatically locates the target detection point automatically.
Image processing function: Support multiple image formats, real-time processing and online saving of detected images. Technical parameters
Light pipe voltage: 90-130KV (optional as needed)
Light pipe current: 89-455uA (optional as needed)
Focus size: 5-15um
Cooling method: forced air cooling
Type: Enhancer / Flat Panel Detector
Field of view: Φ100mm/114.9mm*64.6mm (can be configured as needed)
Resolution: 1392*1040/1536*864pixels (optional as needed)
Geometric magnification: 12-48X
Repeated test accuracy: 60um
Software inspection speed: ≥1.5/test point (excluding loading and unloading and movement time)
Standard size: 515mmX460mm
Effective detection area: 450mmX410mm
Load capacity: ≤5Kg
International Radiation Safety Standard: ≤1μSV/hr
Computer: 22" widescreen LCD / touch screen display / I5 processor / memory 4G / hard disk 500G
Size / Weight: 1136mm * 1076mm * 1730mm About 750Kg
Power: AC220V 10A
Temperature and humidity: 25 °C ± 3 °C RH50% ± 10%
Introduction
The X-ray inspection machine adopts the principle of X-ray transmission to perform real-time photo detection on the internal structure of the object under test. Widely used in battery, SMT, LED, electronic product processing and casting processing industries, mainly to analyze the internal defects of the product, so that users can easily obtain high-quality, high-magnification, high-resolution images.
