X6600BM Universal Microfocal Spot X-RAY Detection Equipment Introduction: X6600BM is a six axis universal offline precision micro focal spot X-ray detection device with the characteristics of high magnification, multi angle detection, and large area detection platform. It is mainly used for semiconductor, SMT, DIP, and electronic component detection, covering various packaging types such as PCBA, IC, BGA, CSP, IGBT, sensors, fuses, flip chip, etc; It can also be used in automotive parts, aluminum die-casting molds, LED, batteries, and photovoltaic industries. characteristic: 1. The X-ray source adopts the world's top Hamamatsu closed X-ray tube from Japan, which has a long lifespan and is maintenance free; 2. High resolution design to obtain the best image in a very short time; 3. Laser automatic navigation and positioning, quickly selecting shooting positions; 4. X/Y/Z axis motion control, easy to operate; 5. CNC detection mode, fast automatic detection for multi-point arrays; 6. Inclined multi angle detection makes it easier to detect sample defects; 7. The light tube flat plate can rotate simultaneously (0-60 °), making the detection image clearer and more intuitive; 8. Easy and fast operation, quick identification of target defects, two hours of training to get started; Technical parameters: X-ray source Ray tube type: reflective sealed micro focal point line source Tube voltage range: 40-90KV/40-130KV Tube current range: 10-200 μ A/10-300 μ A Maximum output power: 8W/39W Microfocus size: 5 μ m X-ray beam angle (conical): 45 degree Flat panel detector Plate type: amorphous silicon plate detector Pixel matrix: 1648x1648 Field of view range: 160mmx160mm Resolution: 5.1Lp/mm Image frame rate (1x1): 30fps AD conversion bit: 16bits Tilt angle: 0-60 ° Loading platform Platform size: 620mm * 620mm Detection range: 560mm * 560mm Maximum load: 10kg Chassis Inner lead plate: 5mm thick lead plate (for radiation isolation) Size: 1380mm (L) * 1390mm (W) * 1930mm (H) Weight: approximately 1720kg
Introduction: X6600BM is a six axis universal offline precision micro focal spot X-ray detection device with the characteristics of high magnification, multi angle detection, and large area detection platform. It is mainly used for semiconductor, SMT, DIP, and electronic component detection, covering various packaging types such as PCBA, IC, BGA, CSP, IGBT, sensors, fuses, flip chip, etc; It can also be used in automotive parts, aluminum die-casting molds, LED, batteries, and photovoltaic industries.
