WFB-HO-25T1 high-performance powder slicer Introduction: The WFB-HO-25T1 high-performance powder slicer can achieve high-purity slicing of non viscous powders such as oxides, nitrides, and carbides without the addition of additives. This device is widely used in the molding process of ceramics, electronics, and battery materials, as well as for powder preparation required for various tests such as PL spectroscopy, XRD, UV vis spectroscopy, thermal conductivity, all solid state batteries, etc. Features: 1. Zero addition It is an indispensable molding tool for special ceramic manufacturing to achieve the perfect in-situ molding of non adhesive powders without adding any bonding agents. (Use smaller font sizes for this section) 2. High success rate For powders with poor adhesion such as quartz (SiO2), the success rate of film production can exceed 90%. 3. High efficiency The production speed can reach up to 2 minutes per film, with very low labor intensity and high experimental efficiency 4. Reliable reproduction Exclusive use of pressure direct reading technology, with molding pressure accurate to 1Kg, ensuring accurate reproduction of molding experiments 5. Ultra thin and ultra thick The new demolding technology brings a wider tolerance for film thickness. A carefully designed mold set can achieve full coverage in the thickness range of 0.1mm~20mm. 6. Stacking expert Proficient in multi-layer film production/one-time demolding, providing perfect experimental solutions for the fabrication and testing of all solid state batteries 7. No oil leakage Selected high-quality imported hydraulic systems, 1-year free maintenance, 3-year warranty. Help you get rid of the trouble of frequent oil leakage in hydraulic cylinders. Technical parameters: Forming pressure range: 0-25 T Hydraulic press piston diameter: phi=80 mm Hydraulic press piston stroke: 50 mm Demoulding pressure range: 0~0.7 MPa Production operation mode: manual Forming pressure accuracy: 10 Kg Forming thickness range: 0.1-20 mm Configuration mold: 2 sets (complimentary) 10-50 mm optional
Introduction: The WFB-HO-25T1 high-performance powder slicer can achieve high-purity slicing of non viscous powders such as oxides, nitrides, and carbides without the addition of additives. This device is widely used in the molding process of ceramics, electronics, and battery materials, as well as for powder preparation required for various tests such as PL spectroscopy, XRD, UV vis spectroscopy, thermal conductivity, all solid state batteries, etc.
