Sales SYJ-800 CNC Dicing Cutting Machine，Manufacturer

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SYJ-800 CNC Dicing Cutting Machine for Crystal, ceramic, glass

Product ID：GJZqiege009

Price: Please inquire PDF Format

Supply Ability:20SETS/MON

Port:SHENZHEN

Product Introduction
Consulting

Model NumberSYJ-800

Brand NameSYKJ

Payment TermsT/T, paypal

Brief introduction
SYJ-800 is a CE certified dicing saw, designed for dicing and cutting almost all kinds of materials up to 8" diameter wafer or 8" L x 8" W x 1" H components. The SYJ-800 saw can be programmable by computer with position accuracy of 0.01 mm in X, Y.Z three dimension and the sample stage can be rotated by an electric motor to cut sample at any angle with +/- 0.5° tolerance. It is an excellent tool for dicing Al2O3 ceramic sheet and Si or Ge wafer for electronic substrates and solar power panels. ( updated 6" blade and water splashing protect box since 3/25/2015 )
Technical parameters

Voltage	AC 110V (AC 220V 50/60Hz is available with ordering a 500W transformer)
Motor	1/2 HP high torque DC motor (110V) with 0-3000.RPM
Effective Dicing Range	· Dicing Area : X-axis: 8" Y-axis:8" · Dicing Depth: depended on cutting blade diameter: o 4" Blade's Max. dicing depth <= 2 mm o 6" Blade's Max. dicing depth <= 20mm o If sample area <= 2"x 2", cutting depth can reach Max. 2" by 6" blade and suitable flange · Rotation: 360° by motor (rotate speed/degree programmable)
Accuracy	0.0025 mm moving resolution and 0.01 mm position accuracy.
Dicing Blades	· Two diamond blades are included: o One 4" Dia x 0.35mm (thickness) x 0.5" arbor fully sintered diamond blade o One 6" Dia x 0.35mm (thickness) x 0.5" arbor edge sintered diamond blade · Two water splashing protectors are included. One for 4" blade and the another one is for 6" blade · Dicing blades are consumable, please click picture below to order spare
PC software	· Labtop and PC software are provided with the equipment. · Cutting parameters can be set in the software such as cutting length, width, time, feed speed, kerf loss, etc. Rotation is controlled independently. · Manual or programmable control mode · compatible with Win 7 / 8 / 8.1
Sample Stage and Holder	One 220mm diameter glass sample plate and 8" vacuum chuck are included ( The glass sample plate has a flat surface which can be soaked and hold in position by a vacuum chuck. Also, the glass plate can prevent the vacuum chuck from being damaged by saw blade during cutting process.)
Water Cooling	Assemblies of water jetting, draining, and splashing protection is included.
Net Weight	90 kg
Shipping Weight	290 lbs
Dimensions	Machine: 740 x570 x700 mm Control box: 340 x260 x190 mm
Shipping Dimension	55''x39"x44"
Warranty	One year limited with lifetime support --- including all electronic and mechanical parts. Damaged parts caused by misuse: such as rusted part from inadequate storage and broken parts by the user are not covered by the standard warranty.
Certification	CE Certified

Brief introduction
SYJ-800 is a CE certified dicing saw, designed for dicing and cutting almost all kinds of materials up to 8" diameter wafer or 8" L x 8" W x 1" H components. The SYJ-800 saw can be programmable by computer with position accuracy of 0.01 mm in X, Y.Z three dimension and the sample stage can be rotated by an electric motor to cut sample at any angle with +/- 0.5° tolerance. It is an excellent tool for dicing Al2O3 ceramic sheet and Si or Ge wafer for electronic substrates and solar power panels. ( updated 6" blade and water splashing protect box since 3/25/2015 )