SemiPOL high-precision quantitative grinding machine Introduction: SemiPOL is capable of precise grinding and polishing of various materials (optical lenses, semiconductor chips, metal and non-metal crystal phases) for microscopic analysis (SEM, FIB, TEM, etc.). The target accuracy is in the micrometer range. Mainly used for parallel grinding and polishing, combined with more accessories, making it easier to grind and polish complex irregular parts and surfaces. Real time monitoring of material removal amount, or quantifying the set amount of material debris and achieving unmanned operation. Driven by a dual stepper motor, it controls the swing speed and amplitude of the grinding seat to improve the flatness, smoothness, and utilization rate of grinding consumables of the grinding parts. characteristic: 1. Grinding disc size: 8 inches (Φ 203mm); 2. Grinding disc speed: 0-600rpm, can rotate forward/reverse; 3. Real time display of material removal amount on LCD screen, with a resolution of 1um and a stable accuracy of 10um; 4. The material grinding amount can be set with a resolution of 1um and a stable accuracy of 10um. When the amount of debris reaches the set value, the equipment will automatically stop running; 5. The grinding time can be set, and when the grinding time reaches the set value, the equipment will automatically stop running; 6.7-inch LCD display/touch screen, capable of saving/editing at least 20 sets of parameters; 7. The sample can rotate on its own or not, and can oscillate back and forth with adjustable oscillation amplitude; 8. Automatic/manual control of cooling water on/off; 9. The spindle motor has a power of 750W and uses servo motors for high torque and constant torque output; The sample swing adopts a stepper motor, which has greater torque and greater durability; Technical parameters: 1. Model: SemiPOL 2. Workplate diameter: 8 inches Speed: 0-600rpm, stepless speed regulation Steering: CW/CCW Power: 750W Factory verification: Flatness<2um 3. Sample clamping head speed: 0-50rpm, stepless speed regulation Steering: CW/CCW Half rotation: Yes, adjustable amplitude Swing: Yes, adjustable amplitude and speed Factory verification: perpendicularity to the disc<2um; Parallel degree<2um Maximum removal capacity: 20mm 4. Power supply: 220VAC 5. Panel: 7-inch touch screen 6. Size WxDxH: 700x430x580mm 7. Weight: 57kg
Introduction: SemiPOL is capable of precise grinding and polishing of various materials (optical lenses, semiconductor chips, metal and non-metal crystal phases) for microscopic analysis (SEM, FIB, TEM, etc.). The target accuracy is in the micrometer range. Mainly used for parallel grinding and polishing, combined with more accessories, making it easier to grind and polish complex irregular parts and surfaces. Real time monitoring of material removal amount, or quantifying the set amount of material debris and achieving unmanned operation. Driven by a dual stepper motor, it controls the swing speed and amplitude of the grinding seat to improve the flatness, smoothness, and utilization rate of grinding consumables of the grinding parts.
