Sales HR-Sub-Nano series fiber sub-nanosecond laser，Manufacturer

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HR-Sub-Nano series fiber sub-nanosecond laser

Product ID：GJGjgchanpin011

Price: Please inquire PDF Format

Supply Ability:20SETS/MON

Port:SHENZHEN

Product Introduction
Consulting

Model NumberHR-Sub-Nano

Brand NameWUHANHUARI

Payment TermsT/T, paypal

HR-Sub-Nano series fiber sub-nanosecond laser
Introduction:
The HR-Sub-Nano series pulsed fiber sub-nanosecond laser series is a stable and reliable laser product independently developed by Huaray, which supports high-definition processing while ensuring economy. This series of products adopts integrated light and electricity design with pulse width less than 1 ns (800 ps-5 ns optional), which can be widely used in material micromachining, solar/photovoltaic industry processing, glass based ink removal/marking, FPC Cover film cutting, PVD removal, plastic marking, glass texturing and other fields.
characteristic:
1. Support 355/1064nm wavelength
2. Support 800ps-5ns pulse width optional
3. Single pulse energy 10μJ@355nm
4. Air cooling
5. Integrated design of light and electricity
6. One-button operation without any adjustment knob
7. Remote control, maintenance free
Technical Parameters:

Wavelength	355 nm
Average Power	3 W @ 300 kHz
Pulse Energy	>10 μJ
Pulse Duration	<1 ns (Optional 0.8-5 ns)
Peak Power	>10 kW
Repetition Rate	50 kHz - 500 kHz
Beam Quality	M2≤1.4
Beam Divergence	<2 mrad, 2θ
Beam Circularity	≥90%
Beam Diameter	≤10 mm, 1/e2
Polarization Ratio	>100:1
Polarization Direction	Horizontal
Pulse Energy Stability	<2% RMS
Power Stability	<2% RMS
External Comms	RS-232, Ethernet, USB

Introduction:
The HR-Sub-Nano series pulsed fiber sub-nanosecond laser series is a stable and reliable laser product independently developed by Huaray, which supports high-definition processing while ensuring economy. This series of products adopts integrated light and electricity design with pulse width less than 1 ns (800 ps-5 ns optional), which can be widely used in material micromachining, solar/photovoltaic industry processing, glass based ink removal/marking, FPC Cover film cutting, PVD removal, plastic marking, glass texturing and other fields.