Brief introduction: High IC integration and miniaturization promote the continuous improvement and improvement of IC packaging technology, the chip is getting smaller and smaller, and the FRAME carrying the chip also tends to be ultra-thin and ultra-wide. Risk of (touching lead collapse, bend, etc.) may occur when the DA/WB process detects chip defects or welding line defects. The donghongxin frame tester adopts the automatic adjustment program of imported PLC, which can be adjusted according to the size of WB welding line material box, to avoid direct contact with the product in the process of detecting the chip frame, to avoid the problem of bending, deformation and bruising of the chip frame, and to improve quality and production efficiency. Advantage: 1. The MAGAZINE can move up and down automatically; 2.FRAME can move around quickly and conveniently (increase efficiency several times), and there is no risk of docking; 3. Avoid the risk of touching FRAME all the way; 4. The testing equipment of different specifications can be customized according to the requirements.
Brief introduction: High IC integration and miniaturization promote the continuous improvement and improvement of IC packaging technology, the chip is getting smaller and smaller, and the FRAME carrying the chip also tends to be ultra-thin and ultra-wide. Risk of (touching lead collapse, bend, etc.) may occur when the DA/WB process detects chip defects or welding line defects. The donghongxin frame tester adopts the automatic adjustment program of imported PLC, which can be adjusted according to the size of WB welding line material box, to avoid direct contact with the product in the process of detecting the chip frame, to avoid the problem of bending, deformation and bruising of the chip frame, and to improve quality and production efficiency.
