DRE-III multifunctional fast thermal conductivity tester
Introduction: This thermal conductivity meter adopts the transient plane heat source method, based on the TPS transient plane heat source technology, uses Hot Disk probes, special high-precision unit instrument testing and communication technology, and uses computer high-speed data processing technology to quickly collect and complete the probe data. The mathematics model is calculated quickly, and accurate and reliable results can be quickly tested; professional instruments make the whole machine extremely reliable, easy to operate, and quick and convenient to maintain. Test materials: metal, ceramics, alloys, thermal conductive silicone grease, silica gel, silicone rubber, geotechnical, rock, polymer, paper, fabric, foam plastic, concrete, composite board, paper honeycomb panel and other solid, powder, liquid, paste , Coatings, films, anisotropic materials, etc. thermal conductivity, temperature conductivity (thermal diffusion coefficient) and specific heat capacity, heat storage coefficient and thermal resistance. Features: 1. Direct measurement of heat transmission can save a lot of time; 2. Will not be affected by contact thermal resistance like static method; 3. No special sample preparation is required, only a relatively flat sample surface for solid materials. It has the advantages of fast measurement speed, wide application range, and the ability to successfully avoid the influence of natural convection during the experiment. It is currently a popular test method. Technical parameter: 1. The measuring range of thermal conductivity: 0.0001～100 w/(m.k), the resolution is 0.00001w/(m.k); 2. Range of thermal diffusion coefficient (temperature conductivity): 0.1～100 m2/s; 3. Range of heat storage coefficient: 0.1～30 w/(m2.k); 4. Range of specific heat capacity: 0.1～5 kJ/(kg.℃); 5. Thermal resistance range: 0.5～0.000005 mm2.k/w; 6. Temperature measurement accuracy: ≤0.001℃; 7. Relative measurement error: ≤3%; 8. Repeatability error: ≤ 3%; 9. Test time: 1～120 seconds. 10. Sample test temperature range: -40～130℃; standard configuration: room temperature. Various high and low temperature control boxes (-40～130℃) or test status under vacuum can be selected according to customer requirements, the contract is agreed, the cost is extra; 11. Probe configuration: standard configuration: diameter Φ15mm. The probe diameter can be selected according to customer requirements: Φ15mm, Φ7.5mm, or configured at the same time, as agreed in the contract, the cost is extra; 12. Sample requirements: a. For solid block or round, square, and special-shaped samples, no special preparation is required, only a relatively flat sample surface, equipped with a special sample clamping device. The smallest size of the sample measured by the Φ7.5mm probe (15x15x3.75mm), the smallest size of the sample measured by the Φ15mm probe (30x30x7.5mm). b. There are no special requirements for powder, paste and liquid substances, and a special sample test box is provided. c. For thinner materials tested, the samples can be superimposed for testing. 13. Using fully automatic test software, quickly and accurately analyze the parameters of the test process and report output to the samples. 14. Power supply: AC 220V±10%, 50/60 Hz, overall power: <500w;
Introduction: This thermal conductivity meter adopts the transient plane heat source method, based on the TPS transient plane heat source technology, uses Hot Disk probes, special high-precision unit instrument testing and communication technology, and uses computer high-speed data processing technology to quickly collect and complete the probe data. The mathematics model is calculated quickly, and accurate and reliable results can be quickly tested; professional instruments make the whole machine extremely reliable, easy to operate, and quick and convenient to maintain. Test materials: metal, ceramics, alloys, thermal conductive silicone grease, silica gel, silicone rubber, geotechnical, rock, polymer, paper, fabric, foam plastic, concrete, composite board, paper honeycomb panel and other solid, powder, liquid, paste , Coatings, films, anisotropic materials, etc. thermal conductivity, temperature conductivity (thermal diffusion coefficient) and specific heat capacity, heat storage coefficient and thermal resistance.
