Brief introduction: This system USES low-temperature chillers as cold source, without using liquid nitrogen/liquid helium, achieving solid materials at low temperature (4 k to 300 k; - 269 ℃ to room temperature) of the electrical properties (electrical conductivity/resistivity, thermoelectric potential rate/Seebeck Seebeck coefficient) and thermal properties (thermal conductivity, thermal expansion coefficient, specific heat, etc.). In a single or more chiller as the cold source of cryogenic platform, the electrical and thermal property of integrated automatic measurements. Make full use of the low temperature environment of the whole system, greatly reduce the cost of customer purchase instruments, avoid cumbersome and error of the experiment. Technical parameters: Thermal conductivity measurement unit Measuring range: 0.1 W/m, K ~ 600 W/m, K Measurement precision, better than 5% Sample size: cubes: 4 * 6, 4, 6, 8 * 8, 10 * 10 mm x 2 ~ 15 mm The cylinder: Φ 4 ~ 10 mm x 2 ~ 15 mm Electrical conductivity measurement unit (resistivity) Measuring range: 10 mu S/m ~ 10 S/m Measurement precision, better than 1% Sample size: length: 4 ~ 20 mm; Width: 1 ~ 3 mm; High: 1 ~ 3 mm Thermoelectric potential rate (Seebeck coefficient) measurement unit Measuring range: 1 mu ~ 1 V/V/K K Measurement precision, better than 6% Sample size: length: 5 ~ 20 mm; : 2 ~ 3 mm wide; High: 2 ~ 3 mm The thermal expansion coefficient measurement unit Measuring range: - 100 ~ 100-6 / E K Measurement precision, better than 5% Sample size: length: 8 to 15 mm; Width: 5 ~ 15 mm; High: 1 ~ 5 mm The cylinder: Φ 8 ~ 15 mm x 2 ~ 15 mm Specific heat measurement unit Measurement precision, better than 5%
Brief introduction: This system USES low-temperature chillers as cold source, without using liquid nitrogen/liquid helium, achieving solid materials at low temperature (4 k to 300 k; - 269 ℃ to room temperature) of the electrical properties (electrical conductivity/resistivity, thermoelectric potential rate/Seebeck Seebeck coefficient) and thermal properties (thermal conductivity, thermal expansion coefficient, specific heat, etc.).
